Flexible Electronics News

SEMI FlexTech Solicits Proposals to Advance Flexible Hybrid Electronics

Request for Proposals Open Until July 6 with cash rewards from $250,000 to $500,000.

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By: Rachel Klemovitch

Assistant Editor

FlexTech, a SEMI Technology Coalition, issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies. This includes the development of advanced materials and additive processing.

The RFP seeks proposals targeting FHE advances in the following areas:

  • Flexible, Moldable Electronics
  • Advanced Bonding Reliability
  • Novel Flexible Energy Storage Beyond Conventional Architectures
  • 2D Materials

 Selected projects will receive cash awards ranging from $250,000 to $500,000. The program is funded by the Army Research Laboratory (ARL). ARL funding will be matched with contributions by selected recipients to cover the total project cost.

Organizations submitting proposals will be evaluated based on their capabilities, experiences, and strengths. 

See the FlexTech 2026 RFP for more details on the evaluation process.

Full proposal submissions are due July 6, 2026. Awardees will be notified following the review of proposals by the RFP committee. The committee consists of FlexTech Council members and other subject matter experts (SMEs). 

Evaluation criteria include:

  • Rationale
  • Budget
  • Collaboration value
  • Dual-use (industry and military) applicability
  • Relevance to the topics and the FHE ecosystem 
  • Schedules and milestones
  • Reasonable and stretch deliverables
  • Overall proposal quality 

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